Invention Grant
- Patent Title: Method of full-field solder coverage using a vacuum fill head
- Patent Title (中): 使用真空填充头的全场焊接覆盖方法
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Application No.: US13100133Application Date: 2011-05-03
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Publication No.: US08181846B2Publication Date: 2012-05-22
- Inventor: Russell A. Budd , John P. Karidis , Mark D. Schultz
- Applicant: Russell A. Budd , John P. Karidis , Mark D. Schultz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Jose Gutman
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
Public/Granted literature
- US20110203762A1 FILL-HEAD FOR FULL-FIELD SOLDER COVERAGE WITH A ROTATABLE MEMBER Public/Granted day:2011-08-25
Information query
IPC分类:
