Invention Grant
- Patent Title: Lower profile connector assembly
- Patent Title (中): 下型连接器组件
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Application No.: US13075182Application Date: 2011-03-30
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Publication No.: US08183155B1Publication Date: 2012-05-22
- Inventor: Terrance F. Little , Robert Colantuono
- Applicant: Terrance F. Little , Robert Colantuono
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Ming Chieh Chang
- Agent Wei Te Chung; Andrew C. Cheng
- Main IPC: H01R13/10
- IPC: H01R13/10

Abstract:
A connector assembly (1000) includes a first connector (100) including a first insulative housing (11), a plurality of first terminals (12) supported by the first insulative housing, each first contact having a body portion and two contacting portions (124) connected with lateral edges of the body portion; a second connector (200) including a second insulative housing (21), a plurality of second terminals (22) supported by the second insulative housing, each second terminal having a body portion and a blade type contacting portion (224); and wherein the contacting portion (224) of each second terminal is sandwiched between the two contacting portions (124) of the corresponding first terminal when the first connector mates with the second connector.
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