发明授权
- 专利标题： Plating film, printed wiring board, and module substrate
- 专利标题（中）： 电镀膜，印刷电路板和模块基板
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申请号： US12869095申请日： 2010-08-26
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公开(公告)号： US08183463B2公开(公告)日： 2012-05-22
- 发明人: Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
- 申请人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JPP2009-202761 20090902; JPP2010-130996 20100608
- 主分类号： H05K1/09
- IPC分类号： H05K1/09
摘要：
The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.
公开/授权文献
- US20110048774A1 PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE 公开/授权日：2011-03-03