Invention Grant
- Patent Title: Thermal transfer sheet
- Patent Title (中): 热转印片
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Application No.: US11910115Application Date: 2006-03-31
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Publication No.: US08187999B2Publication Date: 2012-05-29
- Inventor: Daisuke Fukui
- Applicant: Daisuke Fukui
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Connolly Bove Lodge & Hutz LLP
- Priority: JP2005-105348 20050331
- International Application: PCT/JP2006/306923 WO 20060331
- International Announcement: WO2006/106958 WO 20061012
- Main IPC: B41M5/035
- IPC: B41M5/035 ; B41M5/382 ; B41M5/50

Abstract:
It is an object of the present invention to provide a thermal transfer sheet which has a conductive primer layer having adequate adhesion and heat resistance without using a binder resin, has an excellent antistatic property, and hardly causes troubles in printing.The present invention pertains to a thermal transfer sheet formed by providing a thermally-transferable color material layer on one side of a substrate sheet and providing a heat resistant slipping layer on the other side of the substrate sheet with a primer layer interposed between the slipping layer and the substrate sheet, wherein the primer layer is formed by using a conductive colloidal inorganic pigment ultrafine particle.
Public/Granted literature
- US20090202754A1 THERMAL TRANSFER SHEET Public/Granted day:2009-08-13
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