Invention Grant
- Patent Title: High voltage isolation dual capacitor communication system
- Patent Title (中): 高电压隔离双电容通讯系统
-
Application No.: US12397254Application Date: 2009-03-03
-
Publication No.: US08188814B2Publication Date: 2012-05-29
- Inventor: Gek Yong Ng , Kah Weng Lee , Fun Kok Chow
- Applicant: Gek Yong Ng , Kah Weng Lee , Fun Kok Chow
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01P1/00
- IPC: H01P1/00

Abstract:
According to one embodiment, there is provided a high voltage isolation dual capacitor communication system comprising communication drive and sense electrodes and corresponding first and second capacitors that are formed in two separate devices. The two devices are electrically connected in series to provide a single galvanically-isolated communication system that exhibits high breakdown voltage performance in combination with good signal coupling. The system effects communications between drive and receive circuits through the first and second capacitors, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The system may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes.
Public/Granted literature
- US20090206960A1 High Voltage Isolation Dual Capacitor Communication System Public/Granted day:2009-08-20
Information query