In one embodiment of the invention, a flash memory dual inline memory module (FMDIMM) is disclosed. The FMDIMM includes a printed circuit board (PCB) with an edge connector; a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector; and a first address device mounted to the PCB and electrically coupled to the edge connector and the first plurality of multi-chip packaged flash memory/support ASIC parts. Each of the first plurality of multi-chip packaged flash memory/support ASIC parts includes one or more randomly accessible flash memory die to periodically store data in a non-volatile manner.