发明授权
- 专利标题： Multi-chip assembly with optically coupled die
- 专利标题（中）： 具有光耦合模的多芯片组装
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申请号： US12938608申请日： 2010-11-03
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公开(公告)号： US08189361B2公开(公告)日： 2012-05-29
- 发明人: Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
- 申请人： Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L31/147
- IPC分类号： H01L31/147
摘要：
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
公开/授权文献
- US20110058419A1 MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE 公开/授权日：2011-03-10
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