Invention Grant
- Patent Title: Methods and software for printing materials onto a substrate
- Patent Title (中): 将材料印刷到基材上的方法和软件
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Application No.: US12175423Application Date: 2008-07-17
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Publication No.: US08191018B1Publication Date: 2012-05-29
- Inventor: Steven Molesa , Erik Scher , Patrick Smith , Michael Kocsis
- Applicant: Steven Molesa , Erik Scher , Patrick Smith , Michael Kocsis
- Applicant Address: US CA San Jose
- Assignee: Kovio, Inc.
- Current Assignee: Kovio, Inc.
- Current Assignee Address: US CA San Jose
- Agency: The Law Offices of Andrew D. Fortney, Ph.D., P.C.
- Agent Andrew D. Fortney
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G06K9/00

Abstract:
Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.
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