Invention Grant
US08191018B1 Methods and software for printing materials onto a substrate 有权
将材料印刷到基材上的方法和软件

Methods and software for printing materials onto a substrate
Abstract:
Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.
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