Invention Grant
US08191240B2 Method for winding lead wire on multilayer coil electronic components
有权
将引线缠绕在多层线圈电子部件上的方法
- Patent Title: Method for winding lead wire on multilayer coil electronic components
- Patent Title (中): 将引线缠绕在多层线圈电子部件上的方法
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Application No.: US13100555Application Date: 2011-05-04
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Publication No.: US08191240B2Publication Date: 2012-06-05
- Inventor: Yoshimitsu Ishido , Ryo Watanabe
- Applicant: Yoshimitsu Ishido , Ryo Watanabe
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2008-316450 20081212
- Main IPC: H01F7/06
- IPC: H01F7/06

Abstract:
A method for winding a lead wire on a multi-winding electronic component is provided. The method can prevent winding slack of the lead wire, a break of the lead wire, and/or a terminal disconnection failure. A lead wire is wound around a winding core by a certain number of turns to form at least one first layer. Next, the lead wire is folded back toward an electrode, is pulled toward the electrode at an end-of-winding side so as to be across the second layer. Then, the lead wire is caught at a bottom part of the collar to form a final terminal part for boding to the electrode.
Public/Granted literature
- US20110203105A1 METHOD FOR WINDING LEAD WIRE ON MULTILAYER COIL ELECTRONIC COMPONENTS Public/Granted day:2011-08-25
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