A device and method for effectuating the temperature compensation testing of digital load cells. The device uses conductive heat transfer to establish and maintain the temperature of the load cell(s) during testing. The device may include a vessel into which one or more load cells to be tested are placed. Temperature control of the load cells may be accomplished by circulating a temperature controlled fluid through the vessel. The vessel containing the one or more load cells may then be placed in a load application device that applies a load(s) to the one or more load cells during testing. Readings from the one or more load cells are used to establish a temperature compensation factor for each load cell tested. In other embodiments, temperature control of the load cells may be accomplished by placing the load cells in contact with a solid heat transfer element(s).