发明授权
US08193628B2 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
有权
印刷电路板，制造印刷电路板的方法，传感器模块和感测装置
- 专利标题： Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
- 专利标题（中）： 印刷电路板，制造印刷电路板的方法，传感器模块和感测装置
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申请号： US12557020申请日： 2009-09-10
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公开(公告)号： US08193628B2公开(公告)日： 2012-06-05
- 发明人: Toshihiko Makino , Atsushi Koyanagi
- 申请人： Toshihiko Makino , Atsushi Koyanagi
- 申请人地址： JP Tokyo
- 专利权人： Ricoh Company, Ltd.
- 当前专利权人： Ricoh Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2008-260814 20081007; JP2008-317853 20081215
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A printed wiring board on which a package to be arranged, including: a first layer that is relatively rigid; and a second layer that is relatively flexible and on which the package is to be soldered, wherein an area other than a package arrangement area of the second layer is joined to the first layer by an adhesion layer.