发明授权
- 专利标题： Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate
- 专利标题（中）： 测量方法，检查方法，检查装置，半导体器件，半导体器件的制造方法以及元件基板的制造方法
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申请号： US11093803申请日： 2005-03-30
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公开(公告)号： US08193827B2公开(公告)日： 2012-06-05
- 发明人: Masaaki Hiroki
- 申请人： Masaaki Hiroki
- 申请人地址： JP
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Husch Blackwell LLP
- 优先权： JP2001-144193 20010515
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; G01R31/02
摘要：
An inspection method which simplifies an inspection step by eliminating the need to set probes on wiring or probe terminals, and an inspection device for performing the inspection step. A voltage is applied to each of inspected circuits or circuit elements to operate the same. Signal processing is performed on an output from each inspected circuit or circuit element during operation to form a signal (operation information signal) including information on the operating condition of the circuit or the circuit element. The operation information signal is amplified and the amplitude of an alternating current voltage separately input is modulated with the amplified operation information signal. The voltage of the modulated alternating current is read in a non-contact manner to determine whether the corresponding circuit or circuit element is non-defective or defective.
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