Invention Grant
US08193880B2 Transmitting radio frequency signal in semiconductor structure 有权
在半导体结构中发射射频信号

Transmitting radio frequency signal in semiconductor structure
Abstract:
A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.
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