Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US12591102Application Date: 2009-11-09
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Publication No.: US08194353B2Publication Date: 2012-06-05
- Inventor: Tetsuya Ohsawa , Toshiki Naito
- Applicant: Tetsuya Ohsawa , Toshiki Naito
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO Corporation
- Current Assignee: NITTO DENKO Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-289048 20081111
- Main IPC: G11B5/48
- IPC: G11B5/48

Abstract:
A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.
Public/Granted literature
- US20100118445A1 Suspension board with circuit Public/Granted day:2010-05-13
Information query
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