发明授权
- 专利标题： Method for taking an electronic component out of a carrier tape
- 专利标题（中）： 从载带中取出电子部件的方法
-
申请号： US12654116申请日： 2009-12-10
-
公开(公告)号： US08196278B2公开(公告)日： 2012-06-12
- 发明人: Tomokazu Nakashima , Masako Okazaki , Masayuki Itoh
- 申请人： Tomokazu Nakashima , Masako Okazaki , Masayuki Itoh
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Staas & Halsey LLP
- 主分类号： H05K13/04
- IPC分类号： H05K13/04
摘要：
A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.