Invention Grant
- Patent Title: Positive photosensitive resin composition
- Patent Title (中): 正型感光性树脂组合物
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Application No.: US12581974Application Date: 2009-10-20
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Publication No.: US08198002B2Publication Date: 2012-06-12
- Inventor: Doo-Young Jung , Ji-Young Jeong , Hyun-Yong Cho , Yong-Sik Yoo , Min-Kook Chung , Jong-Hwa Lee , Kil-Sung Lee , Myoung-Hwan Cha
- Applicant: Doo-Young Jung , Ji-Young Jeong , Hyun-Yong Cho , Yong-Sik Yoo , Min-Kook Chung , Jong-Hwa Lee , Kil-Sung Lee , Myoung-Hwan Cha
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Summa, Additon & Ashe, P.A.
- Priority: KR10-2008-0102568 20081020
- Main IPC: G03F7/023
- IPC: G03F7/023
Abstract:
Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent.
Public/Granted literature
- US20100099043A1 Positive Photosensitive Resin Composition Public/Granted day:2010-04-22
Information query
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