发明授权
- 专利标题: Ceramic package for headlamp and headlamp modul having the same
- 专利标题(中): 用于前照灯和前照灯模块的陶瓷包装相同
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申请号: US12343455申请日: 2008-12-23
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公开(公告)号: US08203165B2公开(公告)日: 2012-06-19
- 发明人: Young Jin Lee , Hyung Kun Kim
- 申请人: Young Jin Lee , Hyung Kun Kim
- 申请人地址: KR Gyunggi-Do
- 专利权人: Samsung LED Co., Ltd.
- 当前专利权人: Samsung LED Co., Ltd.
- 当前专利权人地址: KR Gyunggi-Do
- 代理机构: McDermott Will & Emery, LLP
- 优先权: KR10-2008-0119183 20081127
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
Provided is a ceramic package for headlamp, and a headlamp module having the same. The ceramic package for headlamp includes a body part, a pair of internal electrodes, and an electrode exposing part. The body part has a cavity formed therein. The cavity is upwardly opened to expose a light emitting diode mounted on a mounting part. The pair of internal electrodes in the body part is electrically connected to the light emitting diode. The electrode exposing part is stepped at either side of the body part to upwardly expose the internal electrode to the outside.
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