发明授权
- 专利标题： Integrated circuit package system with encapsulating features
- 专利标题（中）： 集成电路封装系统具有封装特性
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申请号： US11694921申请日： 2007-03-30
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公开(公告)号： US08207600B2公开(公告)日： 2012-06-26
- 发明人: Henry Descalzo Bathan , Jeffrey D. Punzalan , Abelardo Hadap Advincula , Jose Alvin Caparas
- 申请人： Henry Descalzo Bathan , Jeffrey D. Punzalan , Abelardo Hadap Advincula , Jose Alvin Caparas
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley Chang
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
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