Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy.