公开(公告)号：US20110191998A1

公开(公告)日：2011-08-11

申请号：US13089421

申请日：2011-04-19

Applicant: Kevin D. Christian ,  Gheorghe Korony

Inventor： Kevin D. Christian ,  Gheorghe Korony

IPC: H01G7/00

CPC classification number: H01G4/38 ,  H01G4/33 ,  H01L27/016 ,  Y10T29/43 ,  Y10T29/435

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract translation: 公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。 在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。 单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。 精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。 可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

公开(公告)号：US08689417B2

公开(公告)日：2014-04-08

申请号：US13089421

申请日：2011-04-19

Applicant: Kevin D. Christian ,  Gheorghe Korony

Inventor： Kevin D. Christian ,  Gheorghe Korony

IPC: H01G7/00

CPC classification number: H01G4/38 ,  H01G4/33 ,  H01L27/016 ,  Y10T29/43 ,  Y10T29/435

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract translation: 公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。 在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。 单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。 精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。 可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

公开(公告)号：US07714688B2

公开(公告)日：2010-05-11

申请号：US11334051

申请日：2006-01-18

Applicant: Gheorghe Korony ,  Robert H. Heistand, II

Inventor： Gheorghe Korony ,  Robert H. Heistand, II

IPC: H01F5/00

CPC classification number: H01F41/041 ,  H01F17/0006 ,  H01F27/34 ,  H01F2017/0046 ,  H01F2021/125

Abstract: Disclosed is methodology and apparatus for producing a planar inductor having a high quality (Q) factor. The inductor is formed by providing a first, relatively wide coil turn, and at least a pair of relatively more narrow second coil turns, displaced in a different plane from that occupied by the first coil turn. The configuration of such coil turns produces a high value of mutual coupling among the coil turns, resulting in an inductor having a high quality (Q) factor.

Abstract translation: 公开了用于生产具有高质量（Q）因子的平面电感器的方法和装置。 电感器通过提供第一相对较宽的线圈匝和至少一对相对较窄的第二线圈匝来形成，第二线圈匝在与第一线圈匝所占据的平面不同的平面内移位。 这种线圈匝的配置在线匝之间产生高的互耦值，导致具有高质量（Q）因子的电感器。

公开(公告)号：US20080273285A1

公开(公告)日：2008-11-06

申请号：US12112382

申请日：2008-04-30

Applicant: Kevin D. Christian ,  Gheorghe Korony

Inventor： Kevin D. Christian ,  Gheorghe Korony

IPC: H01G7/00

CPC classification number: H01G4/38 ,  H01G4/33 ,  H01L27/016 ,  Y10T29/43 ,  Y10T29/435

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract translation: 公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。 在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。 单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。 精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。 可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

公开(公告)号：US06285542B1

公开(公告)日：2001-09-04

申请号：US09293817

申请日：1999-04-16

Applicant: Robert M. Kennedy, III ,  Gheorghe Korony ,  Donghang Liu ,  Jeffrey P. Mevissen ,  Robert H. Heistand, II

Inventor： Robert M. Kennedy, III ,  Gheorghe Korony ,  Donghang Liu ,  Jeffrey P. Mevissen ,  Robert H. Heistand, II

IPC: H01G438

CPC classification number: H01L27/0682 ,  H01G4/40 ,  H05K1/023 ,  H05K3/3436 ,  Y10T29/435

Abstract: A very small electronic device adapted for inverted mounting to a circuit board includes a multiplicity of capacitors and resistors built on a substrate. The capacitors and resistors are interconnected so as to provide multiple RC circuits in various circuit arrangements. The multiple layers of the device are covered by an encapsulate having openings to expose terminal pads of the RC circuits. The openings are filled with solder to produce the individual terminations of the device in a ball grid array (BGA). The device saves cost and/or board space in the manufacture of larger electronic equipment through the elimination of multiple discrete components. In addition, very low inductance is achieved due to the close proximity of the device to a circuit board on which it is mounted.

Abstract translation: 适于反向安装到电路板的非常小的电子设备包括多个形成在基板上的电容器和电阻器。 电容器和电阻器互连，以便在各种电路布置中提供多个RC电路。 器件的多层被具有开口的封装体覆盖以暴露RC电路的端子焊盘。 这些开口填充有焊料以在球栅阵列（BGA）中产生装置的各个终端。 该设备通过消除多个分立元件，节省了大型电子设备制造中的成本和/或电路板空间。 此外，由于器件与其所安装的电路板的紧密接近，实现了非常低的电感。

公开(公告)号：US09450556B2

公开(公告)日：2016-09-20

申请号：US12904315

申请日：2010-10-14

Applicant: Gheorghe Korony ,  Andrew P. Ritter

Inventor： Gheorghe Korony ,  Andrew P. Ritter

IPC: H05K7/00 ,  H01G5/00 ,  H03H7/01 ,  H01C1/148 ,  H01C7/00 ,  H01F5/00 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H03H1/00

CPC classification number: H03H7/17 ,  H01C1/148 ,  H01C7/006 ,  H01F5/003 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/111 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/467 ,  H05K3/4697 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

Abstract translation: 表面贴装元件及相关方法涉及第一和第二绝缘基板之间的薄膜电路。 薄膜电路可以包括无源组件，包括电阻器，电容器，电感器，这种组件的阵列，网络或多个无源组件的滤波器。 这样的薄膜电路可以被夹在具有暴露于表面安装部件的外部并且电连接到外部端子的内部导电焊盘的第一和第二绝缘基板之间。 外部终端可以包括至少一层导电聚合物。 可选的屏蔽层可以保护表面贴装元件免受信号干扰。 覆盖衬底可以形成有多个导电元件，其被设计为与导电焊盘大体对准，使得导电元件部分沿着器件的表面以组的形式暴露。

公开(公告)号：US08208266B2

公开(公告)日：2012-06-26

申请号：US12119800

申请日：2008-05-13

Applicant: Gheorghe Korony

Inventor： Gheorghe Korony

IPC: H05K1/16 ,  H05K3/00

CPC classification number: H01P1/20 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/16 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0317 ,  H05K2201/09154 ,  H05K2201/10045 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy.

Abstract translation: 形状的集成无源器件和相应的方法涉及在基底上的成形无源器件的结构和安装，以便提供机械和电连接。 某些组件和组件组件与表面可安装设备的实现相关联。 特殊形状的集成无源器件能够简化安装在印刷电路板或其他安装基板上的选定电路上并同时连接。 成型的电镀侧过滤器装置具有电镀侧面，其提供安装和接地/电力耦合功能。 薄膜过滤器可以构造在硅晶片上，然后用角切割锯从顶表面切割，以在顶表面中产生成形凹槽。 凹槽可以是v形或其他形状，然后用导电材料镀覆。 通过将晶片的后表面向下研磨到凹槽被截取的地方分开各个片段。 电镀槽用作滤波电路的接地或电源连接点。 电镀槽的金属化斜坡用于通过焊接或使用导电环氧树脂将各个片固定到安装表面。

公开(公告)号：US08169772B2

公开(公告)日：2012-05-01

申请号：US12112382

申请日：2008-04-30

Applicant: Kevin D. Christian ,  Gheorghe Korony

Inventor： Kevin D. Christian ,  Gheorghe Korony

IPC: H01G4/005 ,  H01G4/06

CPC classification number: H01G4/38 ,  H01G4/33 ,  H01L27/016 ,  Y10T29/43 ,  Y10T29/435

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract translation: 公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。 在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。 单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。 精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。 可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

公开(公告)号：US20110090665A1

公开(公告)日：2011-04-21

申请号：US12904315

申请日：2010-10-14

Applicant: Gheorghe Korony ,  Andrew P. Ritter

Inventor： Gheorghe Korony ,  Andrew P. Ritter

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H03H7/17 ,  H01C1/148 ,  H01C7/006 ,  H01F5/003 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/111 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/467 ,  H05K3/4697 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and/or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and/or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and/or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements.

Abstract translation: 表面安装部件和相关的制造方法涉及设置在第一和第二绝缘基板之间的一个或多个薄膜电路。 薄膜电路可以包括一个或多个无源组件，包括电阻器，电容器，电感器，一个或多个无源组件的阵列，多个无源组件的网络或滤波器。 这样的薄膜电路可以夹在第一和第二绝缘基板之间，其中内部导电焊盘暴露在表面安装部件的端部和/或侧表面之间的基板之间。 暴露的导电焊盘然后电连接到外部端接。 外部终端可以包括各种不同的材料，包括至少一层导电聚合物，并且可以形成为端接条，端盖等。 也可以在顶部和/或底部设备表面上设置可选屏蔽层，以保护表面安装部件免受信号干扰。 对于在绝缘基底和覆盖基底之间提供一个或多个薄膜电路的实施例，这样的薄膜电路可以形成有导电垫，其延伸到并最初沿所得部件的一个或多个表面暴露。 覆盖基板形成有多个导电元件（例如，内部有源电极，内部锚定电极和/或外部锚定电极），其被设计成与形成在基底基板上的导电焊盘大致对准，使得导电元件部分暴露 沿着设备的一个或多个外围表面组合。 然后将外部电镀端接件直接形成到导电元件的暴露部分。

公开(公告)号：US20080298031A1

公开(公告)日：2008-12-04

申请号：US12119800

申请日：2008-05-13

Applicant: Gheorghe Korony

Inventor： Gheorghe Korony

IPC: H05K1/16 ,  H05K3/00

CPC classification number: H01P1/20 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/16 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0317 ,  H05K2201/09154 ,  H05K2201/10045 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy.

Abstract translation: 形状的集成无源器件和相应的方法涉及在基底上的成形无源器件的结构和安装，以便提供机械和电连接。 某些组件和组件组件与表面可安装设备的实现相关联。 特殊形状的集成无源器件能够简化安装在印刷电路板或其他安装基板上的选定电路上并同时连接。 成型的电镀侧过滤器装置具有电镀侧面，其提供安装和接地/电力耦合功能。 薄膜过滤器可以构造在硅晶片上，然后用角切割锯从顶表面切割，以在顶表面中产生成形凹槽。 凹槽可以是v形或其他形状，然后用导电材料镀覆。 通过将晶片的后表面向下研磨到凹槽被截取的地方分开各个片段。 电镀槽用作滤波电路的接地或电源连接点。 电镀槽的金属化斜坡用于通过焊接或使用导电环氧树脂将各个片固定到安装表面。