发明授权
- 专利标题: Separating method of bonded body
- 专利标题(中): 粘结体分离方法
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申请号: US12323562申请日: 2008-11-26
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公开(公告)号: US08211259B2公开(公告)日: 2012-07-03
- 发明人: Mitsuru Sato , Takatoshi Yamamoto , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
- 申请人: Mitsuru Sato , Takatoshi Yamamoto , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
- 申请人地址: JP Tokyo
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-307619 20071128
- 主分类号: B29C65/00
- IPC分类号: B29C65/00
摘要:
A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.
公开/授权文献
- US20090133820A1 SEPARATING METHOD OF BONDED BODY 公开/授权日:2009-05-28
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