公开(公告)号：US20120315450A1

公开(公告)日：2012-12-13

申请号：US13533521

申请日：2012-06-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B37/12 ,  B32B3/10 ,  B32B37/06

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了通过接合膜将两个基底部件接合在一起的接合方法。 接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。 接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US08211259B2

公开(公告)日：2012-07-03

申请号：US12323562

申请日：2008-11-26

申请人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B29C65/00

CPC分类号： B32B43/006 ,  B08B7/0057 ,  B09B5/00 ,  B32B37/06 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2310/0831 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917

摘要： A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

摘要翻译： 提供了一种接合体的分离方法，所述粘合体包括两个基底构件和接合膜，通过该接合膜将基底构件接合在一起，使得能够容易且有效地将接合体分离成两个原始基底构件。 此外，接合膜含有由硅氧烷化合物构成的硅酮材料。 分离方法包括：用接合膜制备粘合体; 并将能量分离到接合薄膜上，使得由于硅酮化合物的分子键的一部分断裂而在接合薄膜内产生裂纹，从而将粘合体分离成第一和第二基底部件。

公开(公告)号：US08679283B2

公开(公告)日：2014-03-25

申请号：US13533521

申请日：2012-06-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B38/00

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了通过接合膜将两个基底部件接合在一起的接合方法。 接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。 接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US08617340B2

公开(公告)日：2013-12-31

申请号：US12323946

申请日：2008-11-26

申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

IPC分类号： B32B38/00

CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

摘要： A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

摘要翻译： 提供了一种通过低成本的具有精细图案的接合膜将两个基底部件接合在一起的接合方法，以及使用该接合方法形成的接合膜的接合体。 接合方法是用于形成通过具有预定图案的接合膜将第一基底部件和第二基材部件接合在一起的接合体的方法。 接合方法包括：使用液滴喷射方法将含有硅酮化合物的硅酮材料的液体材料涂覆在至少一个第一和第二基底构件的表面上，以形成具有对应于预定的 表面图案; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变为具有预定图案的接合膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

公开(公告)号：US07148148B2

公开(公告)日：2006-12-12

申请号：US10309198

申请日：2002-12-04

申请人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

发明人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

IPC分类号： H01L21/302

CPC分类号： H01L21/76838 ,  C25D5/022 ,  C25D7/12 ,  H01L21/0272 ,  H01L21/0274 ,  H01L21/288 ,  H01L21/31127 ,  H01L21/31133

摘要： A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.

摘要翻译： 公开了一种降低制造成本的掩模形成方法。 该方法在待加工构件的表面上形成掩模，以便使用液体材料形成图案化所需的图案。 该方法还包括将抗蚀剂施加到待加工构件的整个表面，干燥所施加的抗蚀剂，通过使用光刻法去除图案形成区域中的抗蚀剂，并加热抗蚀剂来进行图案化。

公开(公告)号：US07098121B2

公开(公告)日：2006-08-29

申请号：US10367854

申请日：2003-02-19

申请人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

发明人： Yoshiaki Mori ,  Takuya Miyakawa ,  Mitsuru Sato ,  Shintaro Asuke ,  Kenichi Takagi

IPC分类号： H01L21/22

CPC分类号： H01L21/3127 ,  H01L21/0212 ,  H01L21/02274 ,  H01L21/0272 ,  H01L21/0273 ,  H01L21/288 ,  H01L21/76838 ,  H01L27/1292

摘要： An object is to provide a mask formation method, which can curtail a manufacturing cost.A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.

摘要翻译： 目的在于提供掩模形成方法，可以减少制造成本。 在待处理构件的正面上形成预定图案的膜的方法被构造成执行改善图案材料溶液与要被加工的构件的粘附的步骤（S 178） 在图案材料溶液的待处理部件的表面上填充设置在掩模中的图案形成用凹部的工序（S180），提高图案的膜质量的工序（S188） 通过处理图案材料溶液形成的薄膜，去除已经粘附在掩模上的图案材料溶液的步骤（S 188），干燥图案材料溶液的步骤（S190）和步骤（S1996） ）对图案膜进行退火处理。

公开(公告)号：US20060152549A1

公开(公告)日：2006-07-13

申请号：US11326537

申请日：2006-01-05

申请人： Shintaro Asuke

发明人： Shintaro Asuke

IPC分类号： B41J2/135

CPC分类号： B41J2/1433 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/164 ,  Y10T29/49401

摘要： A method for producing a nozzle plate in a cost-effective manner is provided. The method produces the nozzle plate by bonding a plurality of chips to a nozzle plate body. Each chip includes a plurality of nozzle holes from which liquid droplets are to be ejected, a liquid droplet ejecting surface in which the nozzle holes are positioned for ejecting the liquid droplets and a liquid-repellant coat provided on the liquid droplet ejecting surface, the liquid-repellant coat exhibiting a liquid repellency with respect to the liquid droplets. The method comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from the same side as the liquid droplet ejecting surface thereof under an atmospheric pressure, while supplying a gaseous mask material for protection of the liquid-repellant coat through the nozzle holes from the opposite side of the liquid droplet ejecting surface in such a manner that the mask material is leaked out over the liquid droplet ejecting surface around the nozzle holes, to thereby remove the liquid-repellant coat exposed outside the mask material; and a bonding step for bonding each chip to the nozzle plate body at the area from which the liquid-repellant coat is removed by the liquid-repellant coat removal step.

摘要翻译： 提供了一种以成本有效的方式制造喷嘴板的方法。 该方法通过将多个芯片接合到喷嘴板体而产生喷嘴板。 每个芯片包括要喷射液滴的多个喷嘴孔，其中喷射孔用于喷射液滴的液滴喷射表面和设置在液滴喷射表面上的防液涂层，液体 对液滴具有疏液性。 该方法包括一种防液涂层去除步骤，用于在大气压力下从与其液滴喷射表面相同侧的每个芯片进行等离子体处理，同时提供用于保护防液涂层的气体掩模材料， 喷嘴孔从液滴喷射表面的相对侧以使得掩模材料在喷嘴孔周围的液滴喷射表面上泄漏出去，从而去除暴露在掩模材料外部的防液涂层; 以及粘合步骤，用于通过防液涂层去除步骤将每个芯片在去除防液涂层的区域上与喷嘴板体接合。

公开(公告)号：US08486218B2

公开(公告)日：2013-07-16

申请号：US13607885

申请日：2012-09-10

申请人： Shintaro Asuke

发明人： Shintaro Asuke

IPC分类号： B32B27/00 ,  B32B37/30

CPC分类号： C09J5/06 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  C09J2483/00 ,  Y10T428/31663

摘要： A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body.

摘要翻译： 提供一种制造半导体衬底的接合体和安装在半导体衬底上的半导体器件的方法。 该方法包括：准备第一基底部件和第二基底部件; 将液体材料的防液性赋予至第一基底构件的接合薄膜非形成区域的至少一部分，以在其上形成防液区域; 将所述液体材料供应到所述第一基底构件上以在所述第一基底构件的接合膜形成区域上选择性地形成液体涂层; 干燥液体涂层以在接合膜形成区域上获得接合膜; 并且由于在接合膜的表面附近形成的接合特性，通过接合膜将第一基底构件和第二基底构件接合在一起，从而获得接合体。

公开(公告)号：US08243249B2

公开(公告)日：2012-08-14

申请号：US12498641

申请日：2009-07-07

申请人： Shintaro Asuke

发明人： Shintaro Asuke

IPC分类号： G02F1/13 ,  G02F1/1337

CPC分类号： G02F1/133719 ,  Y10T428/1005

摘要： A method of manufacturing a liquid crystal device provided with a liquid crystal layer held between a pair of substrates opposed to each other, and an oriented film disposed between at least one of the substrates and the liquid crystal layer, includes: (a) providing an inorganic oriented film to the one of the substrates; (b) forming a first organic film with a first silane-coupling agent, the first organic film randomly covering a surface of the inorganic oriented film with a predetermined coverage factor smaller than 1; and (c) forming, after step (b), a second organic film with a second silane-coupling agent having a carbon number different from a carbon number of the first silane-coupling agent, the second organic film covering the surface exposed from the first organic film, thereby forming the oriented film composed mainly of the first organic film, the second organic film, and the inorganic film.

摘要翻译： 一种制造液晶装置的方法，该液晶装置具有保持在一对相对的一对基板之间的液晶层和位于至少一个基板和液晶层之间的取向膜，其包括：（a） 无机取向薄膜到基板之一; （b）用第一硅烷偶联剂形成第一有机膜，第一有机膜以小于1的预定覆盖系数随机地覆盖无机取向膜的表面; 和（c）在步骤（b）之后形成具有碳数不同于第一硅烷偶联剂的碳数的第二硅烷偶联剂的第二有机膜，所述第二有机膜覆盖从 从而形成主要由第一有机膜，第二有机膜和无机膜构成的取向膜。

公开(公告)号：US20120094132A1

公开(公告)日：2012-04-19

申请号：US13330899

申请日：2011-12-20

申请人： Shintaro Asuke

发明人： Shintaro Asuke

IPC分类号： B32B37/30 ,  B32B27/08 ,  B32B37/12 ,  B32B37/06 ,  B32B37/10

CPC分类号： C09J5/06 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  C09J2483/00 ,  Y10T428/31663

摘要： A method of manufacturing part of a microelectromechanical system (MEMS) and such part manufactured by the method are provided. The method comprises preparing first and second base members; imparting liquid repellency for a liquid material to at least part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member with the aid of the liquid repellency of the liquid repellent region; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first and second base members together through the bonding film due to a bonding property developed in the vicinity of a surface of the bonding film by applying energy thereto to obtain the bonded body.

摘要翻译： 提供了制造微机电系统（MEMS）的一部分的方法以及通过该方法制造的这种部件。 该方法包括制备第一和第二基底构件; 将液体材料的防液性赋予至少部分第一基底构件的接合膜非形成区域，以在其上形成防液区域; 将所述液体材料供应到所述第一基底构件上，以借助于所述拒液区域的拒液性选择性地在所述第一基底构件的接合膜形成区域上形成液体涂层; 干燥液体涂层以在接合膜形成区域上获得接合膜; 并且由于通过施加能量而在接合膜的表面附近形成的接合性，通过接合膜将第一和第二基底部件接合在一起，从而获得接合体。