发明授权
- 专利标题： Method of processing substrate and method of manufacturing substrate for use in liquid ejection head
- 专利标题（中）： 基板的处理方法及液体喷射头用基板的制造方法
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申请号： US12885257申请日： 2010-09-17
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公开(公告)号： US08211719B2公开(公告)日： 2012-07-03
- 发明人: Hiroyuki Morimoto , Masahiko Kubota
- 申请人： Hiroyuki Morimoto , Masahiko Kubota
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Canon U.S.A., Inc., IP Division
- 优先权： JP2009-218924 20090924
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A substrate processing method includes preparing a substrate, a first mask adjacent to a first surface of the substrate and including a first light transmitting portion allowing light to be transmitted therethrough, a condenser adjacent to the first surface, a second mask including a second light transmitting portion, and a photo detecting member including a photo detecting portion detecting light having passed through the second light transmitting portion, the condenser condensing light having passed through the first light transmitting portion toward the second light transmitting portion, the second light transmitting portion allowing the light condensed by the condenser to be transmitted therethrough, and forming a recess in the substrate by laser beam irradiation from a direction opposite to the first surface. When an intensity of the laser beam detected by the photo detecting portion is at or above a specific intensity, the irradiation of the laser beam is stopped.
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