Invention Grant
US08211845B2 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux 有权
用于去除无铅焊剂的清洁组合物和去除无铅焊剂的系统

Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
Abstract:
An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.
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