Invention Grant
- Patent Title: Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
- Patent Title (中): 用于去除无铅焊剂的清洁组合物和去除无铅焊剂的系统
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Application No.: US12999471Application Date: 2009-08-17
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Publication No.: US08211845B2Publication Date: 2012-07-03
- Inventor: Keita Tanaka , Takashi Tanaka
- Applicant: Keita Tanaka , Takashi Tanaka
- Applicant Address: JP Osaka-shi
- Assignee: Arakawa Chemical Industries, Ltd.
- Current Assignee: Arakawa Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2008-217589 20080827
- International Application: PCT/JP2009/064377 WO 20090817
- International Announcement: WO2010/024141 WO 20100304
- Main IPC: C11D7/16
- IPC: C11D7/16 ; C11D7/26 ; C11D7/32 ; C11D7/50 ; B08B3/04

Abstract:
An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.
Public/Granted literature
- US20110094545A1 CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX Public/Granted day:2011-04-28
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