公开(公告)号：US08211845B2

公开(公告)日：2012-07-03

申请号：US12999471

申请日：2009-08-17

申请人： Keita Tanaka ,  Takashi Tanaka

发明人： Keita Tanaka ,  Takashi Tanaka

IPC分类号： C11D7/16 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  B08B3/04

CPC分类号： B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

摘要： An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

摘要翻译： 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US20110094545A1

公开(公告)日：2011-04-28

申请号：US12999471

申请日：2009-08-17

申请人： Keita Tanaka ,  Takashi Tanaka

发明人： Keita Tanaka ,  Takashi Tanaka

IPC分类号： B08B3/04 ,  C11D3/60

CPC分类号： B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

摘要： An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

摘要翻译： 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US08877697B2

公开(公告)日：2014-11-04

申请号：US13380331

申请日：2010-08-20

申请人： Takashi Tanaka ,  Keita Tanaka ,  Yoshinobu Morino

发明人： Takashi Tanaka ,  Keita Tanaka ,  Yoshinobu Morino

IPC分类号： C11D7/50 ,  C11D11/00 ,  C11D7/26 ,  C23G1/24 ,  H05K3/26 ,  H05K3/34

CPC分类号： C11D11/0047 ,  C11D7/263 ,  C11D7/5022 ,  C23G1/24 ,  H05K3/26 ,  H05K3/3489

摘要： An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

摘要翻译： 本发明的目的是提供一种用于去除水溶性无铅焊剂的清洁剂，能够在短时间内清除能够在无铅焊接期间产生的水溶性助焊剂残留物的清洁剂 焊剂使用水溶性助焊剂，清洁剂还具有优异的溶解性能以及优异的窄间隙清洁性能。 用于除去本发明的水溶性，无铅助焊剂的清洁剂每100重量份水包含5至100重量份的二醇醚化合物（A）。

公开(公告)号：US20120090646A1

公开(公告)日：2012-04-19

申请号：US13380331

申请日：2010-08-20

申请人： Takashi Tanaka ,  Keita Tanaka ,  Yoshinobu Morino

发明人： Takashi Tanaka ,  Keita Tanaka ,  Yoshinobu Morino

IPC分类号： B08B3/08 ,  C11D7/60

CPC分类号： C11D11/0047 ,  C11D7/263 ,  C11D7/5022 ,  C23G1/24 ,  H05K3/26 ,  H05K3/3489

摘要： An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

摘要翻译： 本发明的目的是提供一种用于去除水溶性无铅焊剂的清洁剂，能够在短时间内清除能够在无铅焊接期间产生的水溶性助焊剂残留物的清洁剂 焊剂使用水溶性助焊剂，清洁剂还具有优异的溶解性能以及优异的窄间隙清洁性能。 用于除去本发明的水溶性，无铅助焊剂的清洁剂每100重量份水包含5至100重量份的二醇醚化合物（A）。

公开(公告)号：US20220297367A1

公开(公告)日：2022-09-22

申请号：US17692129

申请日：2022-03-10

申请人： Takashi Tanaka

发明人： Takashi Tanaka

IPC分类号： B29C48/31 ,  B29C48/255 ,  B29C48/25

摘要： A die for extrusion molding includes an extrusion port configured to extrude a plastic composition, and a plastic flow channel configured to cause the supplied plastic composition to flow to the extrusion port. The plastic flow channel includes a supply flow channel, and an extrusion flow channel. The supply flow channel is configured to be supplied with the plastic composition. The extrusion flow channel has an upstream end coupled to the supply flow channel, and downstream end having the extrusion port. In the extrusion flow channel, a flow channel cross-sectional area perpendicular to the flow direction of the plastic composition in the extrusion flow channel gradually changes to the extrusion port, and an inner wall surface of a flow channel has a protruding surface protruding toward an inside of the flow channel in a cross section including an extrusion central axis and parallel to the extrusion central axis.

公开(公告)号：US10990043B2

公开(公告)日：2021-04-27

申请号：US16881539

申请日：2020-05-22

申请人： Makoto Nakamura ,  Takashi Tanaka

发明人： Makoto Nakamura ,  Takashi Tanaka

IPC分类号： G03G15/20

摘要： A fixing device receives a recording material having a toner image and applies pressure and heat to fix the toner image. The fixing device includes a fixing member, a sliding member, a pressing member, and a heating member. The fixing member has a rotatable endless belt shape that includes an inner circumferential resin layer. The sliding member is pressed against the inner circumferential surface of the fixing member with a lubricant interposed between the sliding member and the inner circumferential surface. The sliding member has a resin coating layer and slides on the inner circumferential surface. The pressing member presses the recording material toward an outer circumferential surface of the fixing member. The heating member generates heat to heat the recording material. A surface hardness of the inner circumferential surface of the fixing member is smaller than a surface hardness of the sliding surface of the sliding member.

公开(公告)号：US20200033068A1

公开(公告)日：2020-01-30

申请号：US16521019

申请日：2019-07-24

申请人： Takeshi Endoh ,  Takashi Tanaka ,  Akihiko Moki ,  Atsuo Hirai

发明人： Takeshi Endoh ,  Takashi Tanaka ,  Akihiko Moki ,  Atsuo Hirai

IPC分类号： F28D15/04 ,  H05K7/20

摘要： A wick includes a porous body. The porous body includes a plurality of bubbles, a plurality of composite cells, and a plurality of communication holes. The plurality of bubbles has sizes in a range from 0.1 μm to 50 μm, both inclusive, in a cross section obtained when the porous body is cut. The plurality of composite cells is formed by spherical bubbles partially overlapping each other. Bubbles of pore sizes from 5 μm to 10 μm, both inclusive, are most present among the plurality of composite cells. The plurality of communication holes of 5 μm or smaller is between the plurality of bubbles.

公开(公告)号：US20190390918A1

公开(公告)日：2019-12-26

申请号：US16444212

申请日：2019-06-18

申请人： Tomoyasu Hirasawa ,  Kiyotada Katoh ,  Takeshi Endoh ,  Takashi Tanaka ,  Toshihiko Baba ,  Keisuke Ikeda ,  Hiroki Yamasaki

发明人： Tomoyasu Hirasawa ,  Kiyotada Katoh ,  Takeshi Endoh ,  Takashi Tanaka ,  Toshihiko Baba ,  Keisuke Ikeda ,  Hiroki Yamasaki

IPC分类号： F28D15/02 ,  H05K7/20

摘要： A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.

公开(公告)号：US09434151B2

公开(公告)日：2016-09-06

申请号：US13521783

申请日：2010-12-30

申请人： Takashi Tanaka

发明人： Takashi Tanaka

IPC分类号： B41F23/04 ,  B41J11/00 ,  H01L25/075

CPC分类号： B41F23/0486 ,  B41F23/0453 ,  B41J11/002 ,  H01L25/0753 ,  H01L2224/48137

摘要： An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.

摘要翻译： LED单元包括：多个LED模块，每个LED模块具有用于产生紫外线的LED芯片，所述LED芯片设置在具有在一个表面上形成的开口的封装件和形成为覆盖封装的开口的透镜; LED模块沿第一方向安装的基板形基座; 以及散热构件，其中在与第一方向垂直的第二方向上设置有多个基块。 散热构件具有多个倾斜面，其中设置每个基座。 此外，散热构件的一个倾斜表面和另一个倾斜表面在第二方向上相互倾斜。

公开(公告)号：US20150232994A1

公开(公告)日：2015-08-20

申请号：US14129698

申请日：2012-06-04

申请人： Yuichiro Inatomi ,  Takashi Tanaka ,  Mitsuaki Iwashita

发明人： Yuichiro Inatomi ,  Takashi Tanaka ,  Mitsuaki Iwashita

IPC分类号： C23C18/16 ,  C23C18/18

CPC分类号： C23C18/163 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/1655 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/1676 ,  C23C18/168 ,  C23C18/18 ,  C23C18/50 ,  H05K3/187 ,  H05K2203/0165 ,  H05K2203/072 ,  H05K2203/075

摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

摘要翻译： 电镀装置可以均匀地对基板的整个表面进行电镀处理。 电镀装置20包括被配置为保持和旋转衬底2的衬底保持/旋转装置110; 排出装置21，被配置为将电镀液体朝向保持在基板保持旋转装置110上的基板2排出; 以及配置为控制基板保持/旋转装置110和排出装置21的控制器160.此外，排出装置21包括：第一喷嘴40，其具有沿基板2的径向配置的多个排出口41，或具有 沿基板2的径向延伸的排出口42; 以及第二喷嘴45，其具有被配置为比第一喷嘴40的排出口更靠近基板2的中心部分的排出口46。