Invention Grant
- Patent Title: Enhanced thermal management for improved module reliability
- Patent Title (中): 增强热管理，提高模块可靠性
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Application No.: US12194620Application Date: 2008-08-20
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Publication No.: US08214658B2Publication Date: 2012-07-03
- Inventor: Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcolm S. Ware , Roger D. Weekly
- Applicant: Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcolm S. Ware , Roger D. Weekly
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Francis Lammes; Stephen J. Walder, Jr.; Diana R. Gerhardt
- Main IPC: G06F1/00
- IPC: G06F1/00
Abstract:
Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.
Public/Granted literature
- US20100049995A1 Enhanced Thermal Management for Improved Module Reliability Public/Granted day:2010-02-25
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