Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US12410049Application Date: 2009-03-24
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Publication No.: US08216417B2Publication Date: 2012-07-10
- Inventor: Kunio Fujiwara , Junichi Yoshida
- Applicant: Kunio Fujiwara , Junichi Yoshida
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-083917 20080327; JP2008-194789 20080729
- Main IPC: B08B3/02
- IPC: B08B3/02 ; C03C15/00 ; C23F1/00

Abstract:
A substrate treating apparatus for performing a predetermined treatment of substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid; a lifter having holding elements for holding the substrates, and vertically movable between a standby position above the treating tank and a treating position inside the treating tank; lower nozzles arranged on opposite sides at a bottom of the treating tank for supplying the treating liquid; upper nozzles arranged above the lower nozzles for supplying the treating liquid toward the holding elements of the lifter; and a control device for controlling a flow ratio of the treating liquid between the upper nozzles and the lower nozzles according to the treatment.
Public/Granted literature
- US20090242517A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2009-10-01
Information query
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