Invention Grant
- Patent Title: Method for manufacturing printed circuit board using imprinting
- Patent Title (中): 使用印记制造印刷电路板的方法
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Application No.: US11819720Application Date: 2007-06-28
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Publication No.: US08216503B2Publication Date: 2012-07-10
- Inventor: Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
- Applicant: Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0064575 20060710
- Main IPC: B05D5/12
- IPC: B05D5/12 ; B28B3/00 ; B29C59/02 ; B05D3/04 ; H05K1/09

Abstract:
A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.
Public/Granted literature
- US20080008824A1 Method for manufacturing printed circuit board using imprinting Public/Granted day:2008-01-10
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