Invention Grant
- Patent Title: Patterning method
- Patent Title (中): 图案化方法
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Application No.: US12490311Application Date: 2009-06-23
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Publication No.: US08216946B2Publication Date: 2012-07-10
- Inventor: Wei-Cheng Shiu , Hai-Han Hung , Ya-Chih Wang , Chien-Mao Liao , Shing-Yih Shih
- Applicant: Wei-Cheng Shiu , Hai-Han Hung , Ya-Chih Wang , Chien-Mao Liao , Shing-Yih Shih
- Applicant Address: TW Taoyuan
- Assignee: Nanya Technology Corporation
- Current Assignee: Nanya Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
A patterning method has a mask layer and undoped patterns sequentially formed on a target layer. A doping process is performed to surfaces of the undoped patterns to form doped patterns from the surfaces of the undoped patterns. A material is filled in the gaps between the doped patterns. A portion of the doped patterns are then removed to expose the top surfaces of the remaining undoped patterns. The material and the exposed undoped patterns are removed. A portion of the mask layer is removed using the remaining doped patterns as a mask to form a first pattern on the mask layer. A portion of the target layer is removed using the mask layer having the first pattern thereon as a mask so as to form on the target layer a second pattern complementary to the first pattern.
Public/Granted literature
- US20100323521A1 PATTERNING METHOD Public/Granted day:2010-12-23
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