Invention Grant
- Patent Title: Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
- Patent Title (中): 具有磁通路径的电感耦合集成电路及其使用方法
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Application No.: US12841108Application Date: 2010-07-21
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Publication No.: US08217492B2Publication Date: 2012-07-10
- Inventor: Ahmadreza (Reza) Rofougaran
- Applicant: Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: H01L27/08
- IPC: H01L27/08
Abstract:
An integrated circuit includes a first integrated circuit die having a first circuit and a first inductive interface and a second integrated circuit die having a second circuit and a second inductive interface. A substrate is coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit.
Public/Granted literature
- US20100285634A1 INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION PATH AND METHODS FOR USE THEREWITH Public/Granted day:2010-11-11
Information query
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