发明授权
- 专利标题： Semiconductor mounting substrate and method for manufacturing the same
- 专利标题（中）： 半导体安装基板及其制造方法
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申请号： US13031945申请日： 2011-02-22
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公开(公告)号： US08217515B2公开(公告)日： 2012-07-10
- 发明人: Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
- 申请人： Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2006-283356 20061018; JP2006-304734 20061110
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
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