Invention Grant
- Patent Title: Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beam
- Patent Title (中): 用于在暴露于电子束时增加对半导体晶片衬底的导电性的装置
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Application No.: US12179560Application Date: 2008-07-24
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Publication No.: US08218284B2Publication Date: 2012-07-10
- Inventor: Zhong-Wei Chen , Yi Xiang Wang , Juying Dou
- Applicant: Zhong-Wei Chen , Yi Xiang Wang , Juying Dou
- Applicant Address: TW Hsinchu
- Assignee: Hermes-Microvision, Inc.
- Current Assignee: Hermes-Microvision, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Sawyer Law Group, P.C.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B23B31/28
Abstract:
An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.
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