发明授权
- 专利标题: Methods and systems to align wafer signatures
- 专利标题(中): 对准晶片签名的方法和系统
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申请号: US12365445申请日: 2009-02-04
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公开(公告)号: US08219351B2公开(公告)日: 2012-07-10
- 发明人: Douglas Edmund Paradis , Karl Lynn Kenney
- 申请人: Douglas Edmund Paradis , Karl Lynn Kenney
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 代理商 Jacqueline J. Garner; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号: H01L23/043
- IPC分类号: H01L23/043
摘要:
One embodiment relates to a computer method for aligning wafers processed in a semiconductor fabrication facility. In the method, a first arrangement of dies having a common functionality level is identified on a first wafer. A first alignment signature is assigned to the first wafer based on the first arrangement. A second arrangement of dies having the common functionality level is identified on a second wafer. A second alignment signature is assigned to the second wafer based on the second arrangement. The first alignment signature is compared to the second alignment signature, and the first and second wafers are selectively aligned based on a result of the comparison. Other systems and methods are also disclosed.
公开/授权文献
- US20100169036A1 METHODS AND SYSTEMS TO ALIGN WAFER SIGNATURES 公开/授权日:2010-07-01