发明授权
- 专利标题： Closed loop control of pad profile based on metrology feedback
- 专利标题（中）： 基于计量反馈的焊盘轮廓闭环控制
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申请号： US12187675申请日： 2008-08-07
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公开(公告)号： US08221193B2公开(公告)日： 2012-07-17
- 发明人: Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
- 申请人： Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dergosits & Noah LLP
- 主分类号： B24B49/12
- IPC分类号： B24B49/12 ; B24B49/18
摘要：
A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.
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