Invention Grant
- Patent Title: Thermoplastic resin composition with EMI shielding properties
- Patent Title (中): 具有EMI屏蔽性能的热塑性树脂组合物
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Application No.: US12968436Application Date: 2010-12-15
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Publication No.: US08222321B2Publication Date: 2012-07-17
- Inventor: Kyoung Tae Youm , Young Sik Ryu , Young Sil Lee
- Applicant: Kyoung Tae Youm , Young Sik Ryu , Young Sil Lee
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Summa, Additon & Ashe, P.A.
- Priority: KR10-2009-0135027 20091231
- Main IPC: C08K9/10
- IPC: C08K9/10
Abstract:
The present invention provides a thermoplastic resin composition comprising (A) a thermoplastic resin, and (B) a carbon nanofiber-metal composite including a plurality of laminated truncated, conic graphenes continuously coated with a metal. The thermoplastic resin composition according to the present invention can have excellent EMI shielding properties.
Public/Granted literature
- US20110160372A1 Thermoplastic Resin Composition with EMI Shielding Properties Public/Granted day:2011-06-30
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