Invention Grant
- Patent Title: Resonant device, communication module, communication device, and method for manufacturing resonant device
- Patent Title (中): 共振装置,通信模块,通信装置及谐振装置的制造方法
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Application No.: US12503558Application Date: 2009-07-15
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Publication No.: US08222970B2Publication Date: 2012-07-17
- Inventor: Kazunori Inoue , Tokihiro Nishihara , Takashi Matsuda , Shinji Taniguchi
- Applicant: Kazunori Inoue , Tokihiro Nishihara , Takashi Matsuda , Shinji Taniguchi
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2008-186175 20080717
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/70

Abstract:
A resonant device includes first and second piezoelectric thin film resonators. The first piezoelectric thin film resonator includes a substrate, a first lower electrode formed on the substrate, a first piezoelectric film formed over the first lower electrode, and a first upper electrode formed on the piezoelectric film and opposed to the first lower electrode. The second piezoelectric thin film resonator includes a second lower electrode formed above the first upper electrode, a second piezoelectric film formed over the second lower electrode, and a second upper electrode formed on the piezoelectric film and opposed to the second lower electrode. The first membrane region in which the first lower electrode opposes to the first upper electrode through the first piezoelectric film and a second membrane region in which the second lower electrode opposes to the second upper electrode through the second piezoelectric film are laminated through a second cavity.
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