Invention Grant
- Patent Title: Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheet
- Patent Title (中): 用于压敏粘合片的吹塑挤出成型的装置和方法
-
Application No.: US13296591Application Date: 2011-11-15
-
Publication No.: US08226398B2Publication Date: 2012-07-24
- Inventor: Kooki Ooyama , Shinsuke Ikishima , Naoto Hayashi , Tadao Torii , Toshihisa Yamane , Yuuki Katou
- Applicant: Kooki Ooyama , Shinsuke Ikishima , Naoto Hayashi , Tadao Torii , Toshihisa Yamane , Yuuki Katou
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-073371 20100326; JP2010-139486 20100618
- Main IPC: A01J21/00
- IPC: A01J21/00

Abstract:
The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials.
Public/Granted literature
- US20120112380A1 Apparatus and Method for Inflation Extrusion Molding of Pressure-Sensitive Adhesive Sheet Public/Granted day:2012-05-10
Information query