发明授权
- 专利标题： Bond pad design for fine pitch wire bonding
- 专利标题（中）： 接合垫设计用于细间距引线接合
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申请号： US11868850申请日： 2007-10-08
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公开(公告)号： US08227917B2公开(公告)日： 2012-07-24
- 发明人: Shih-Hsun Hsu , Hao-Yi Tsai , Benson Liu , Chia-Lun Tsai , Hsien-Wei Chen , Anbiarshy N. F. Wu , Shang-Yun Hou , Shin-Puu Jeng
- 申请人： Shih-Hsun Hsu , Hao-Yi Tsai , Benson Liu , Chia-Lun Tsai , Hsien-Wei Chen , Anbiarshy N. F. Wu , Shang-Yun Hou , Shin-Puu Jeng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A bonding pad design is disclosed that includes one or more pad groups on a semiconductor device. Each pad group is made up of two or more bonding pads that have an alternating orientation, such that adjacent bonding pads have their bond ball on opposite sides in relation to the adjacent bonding pad.
公开/授权文献
- US20090091032A1 Bond Pad Design for Fine Pitch Wire Bonding 公开/授权日：2009-04-09
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