发明授权
- 专利标题： Integrated circuit packaging system with conductive pillars and method of manufacture thereof
- 专利标题（中）： 具有导电柱的集成电路封装系统及其制造方法
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申请号： US13080070申请日： 2011-04-05
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公开(公告)号： US08232141B2公开(公告)日： 2012-07-31
- 发明人: DaeSik Choi , JoHyun Bae , Junghoon Shin
- 申请人： DaeSik Choi , JoHyun Bae , Junghoon Shin
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley Chang
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02 ; H01L23/48
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside a conductive pillar location; and encapsulating the integrated circuit with an encapsulation having a top surface formed for the conductive pillar to extend beyond.
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