Invention Grant
- Patent Title: Electromagnetic interference noise reduction board using electromagnetic bandgap structure
- Patent Title (中): 电磁干扰降噪板采用电磁带隙结构
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Application No.: US12654766Application Date: 2009-12-31
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Publication No.: US08232478B2Publication Date: 2012-07-31
- Inventor: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0015332 20090224
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.
Public/Granted literature
- US20100212951A1 Electromagnetic interference noise reduction board using electromagnetic bandgap structure Public/Granted day:2010-08-26
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