发明授权
- 专利标题： Package systems having a conductive element through a substrate thereof and manufacturing methods of the same
- 专利标题（中）： 具有通过其基材的导电元件的封装体系及其制造方法
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申请号： US13042733申请日： 2011-03-08
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公开(公告)号： US08232614B1公开(公告)日： 2012-07-31
- 发明人: Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin , Chia-Ming Hung , Jung-Huei Peng , Yi Heng Tsai , Jiou-Kang Lee
- 申请人： Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin , Chia-Ming Hung , Jung-Huei Peng , Yi Heng Tsai , Jiou-Kang Lee
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman Ham & Berner, LLP
- 主分类号： H01L21/52
- IPC分类号： H01L21/52
摘要：
A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one first conductive structure is electrically coupled with the second substrate through at least one germanium-containing layer.
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