发明授权
- 专利标题： Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
- 专利标题（中）： 具有堆叠集成电路的集成电路封装系统及其制造方法
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申请号： US12488383申请日： 2009-06-19
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公开(公告)号： US08236607B2公开(公告)日： 2012-08-07
- 发明人: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 申请人： Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley M. Chang
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/52 ; H01L23/498 ; H01L23/538
摘要：
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a base component to the substrate by a first interconnect; attaching a stack component connected by a second interconnect to the substrate and partially over the base component, the second interconnect different from the first interconnect; molding an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect; and removing the substrate to partially expose the first interconnect and the second interconnect from the encapsulation.
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