Invention Grant
US08236618B2 Method of making a semiconductor chip assembly with a post/base/post heat spreader
有权
制造具有柱/基/后散热器的半导体芯片组件的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base/post heat spreader
- Patent Title (中): 制造具有柱/基/后散热器的半导体芯片组件的方法
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Application No.: US13004881Application Date: 2011-01-12
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Publication No.: US08236618B2Publication Date: 2012-08-07
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/12
Abstract:
A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
- US20110104856A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POST HEAT SPREADER Public/Granted day:2011-05-05
Information query
IPC分类:
