发明授权
- 专利标题: Product management system
- 专利标题(中): 产品管理系统
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申请号: US10594308申请日: 2005-04-06
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公开(公告)号: US08237569B2公开(公告)日: 2012-08-07
- 发明人: Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
- 申请人: Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2004-115225 20040409
- 国际申请: PCT/JP2005/007113 WO 20050406
- 国际公布: WO2005/098745 WO 20051020
- 主分类号: G08B13/14
- IPC分类号: G08B13/14 ; G08B13/00 ; H04Q5/22 ; G06Q30/00 ; G06Q20/00
摘要:
When a product attached with an ID tag is placed inside a package body, there is a risk that communication with an ID tag using a reader/writer is blocked. Then, it is difficult to manage products in a distribution process of products, which leads to lose convenience of ID tags. One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.
公开/授权文献
- US20080224831A1 Product Management System 公开/授权日:2008-09-18
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