公开(公告)号：US08297518B2

公开(公告)日：2012-10-30

申请号：US13164797

申请日：2011-06-21

申请人： Shunpei Yamazaki ,  Yasuyuki Arai ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Yasuyuki Arai ,  Yohei Kanno

IPC分类号： G06K19/00

CPC分类号： G07F7/1008 ,  G06K19/07309 ,  G06K19/07749 ,  G06Q20/346

摘要： Although a product having such the IC chip has been diffused, information on the product may be capable of being perceived, abstracted, falsified, or the like by a third person with his external device during distribution of the product or after purchase of the product. Further, privacy may be seriously infringed. Paper money, various products, and the like are disclosed according to the present invention with an integrated circuit device having a switching memory for controlling reading and writing of information (lock/unlock of information) in order to protect the information recorded and stored in the integrated circuit such as an IC chip installed to the product or the like.

摘要翻译： 虽然具有这样的IC芯片的产品已经被散布，但是在产品分发期间或购买产品之后，产品的信息可能被外部设备的第三人在被感知，抽象，伪造等方面被感知，抽象化，伪造等。 此外，隐私可能会严重侵犯。 根据本发明公开了纸币，各种产品等，其具有集成电路装置，具有用于控制信息的读取和写入（信息的锁定/解锁）的切换存储器，以便保护记录和存储在信息中的信息 集成电路，例如安装在产品上的IC芯片等。

公开(公告)号：US08136735B2

公开(公告)日：2012-03-20

申请号：US10586156

申请日：2005-01-20

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G06K19/06 ,  G06K19/00 ,  G06K19/02

CPC分类号： H01L27/1266 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/13 ,  H01L29/78603 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079

摘要： As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.

摘要翻译： 作为非接触式ID标签，ID标签等广泛使用，需要以相当低的成本制造大量的ID标签。 例如，附着在产品上的ID标签需要以1至几个日元制造，或优选小于1日元。 因此，要求能够以低成本大量制造ID标签的结构和工序。 包括在本发明的ID标签，ID卡和ID标签中的薄膜集成电路器件各自包括诸如薄膜晶体管（TFT）的薄膜有源元件。 因此，通过剥离其上形成有用于分离元件的TFT的基板，可以以低成本大量地制造ID标签等。

公开(公告)号：US20110284974A1

公开(公告)日：2011-11-24

申请号：US13196154

申请日：2011-08-02

申请人： Yasuyuki ARAI ,  Yuko TACHIMURA ,  Yohei KANNO

发明人： Yasuyuki ARAI ,  Yuko TACHIMURA ,  Yohei KANNO

IPC分类号： H01L29/66

CPC分类号： H01L27/1266 ,  G06K19/025 ,  G06K19/07728 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/13 ,  H01L2221/6835 ,  H01L2224/73204

摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.

摘要翻译： 本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。 半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜 夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。 第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。 第一和第三绝缘膜是无机绝缘膜。

公开(公告)号：US20110248089A1

公开(公告)日：2011-10-13

申请号：US13164797

申请日：2011-06-21

申请人： Shunpei YAMAZAKI ,  Yasuyuki ARAI ,  Yohei KANNO

发明人： Shunpei YAMAZAKI ,  Yasuyuki ARAI ,  Yohei KANNO

IPC分类号： G06K19/077

CPC分类号： G07F7/1008 ,  G06K19/07309 ,  G06K19/07749 ,  G06Q20/346

摘要： Although a product having such the IC chip has been diffused, information on the product may be capable of being perceived, abstracted, falsified, or the like by a third person with his external device during distribution of the product or after purchase of the product. Further, privacy may be seriously infringed. Paper money, various products, and the like are disclosed according to the present invention with an integrated circuit device having a switching memory for controlling reading and writing of information (lock/unlock of information) in order to protect the information recorded and stored in the integrated circuit such as an IC chip installed to the product or the like.

摘要翻译： 虽然具有这样的IC芯片的产品已经被散布，但是在产品分发期间或购买产品之后，产品的信息可能被外部设备的第三人在被感知，抽象，伪造等方面被感知，抽象化，伪造等。 此外，隐私可能会严重侵犯。 根据本发明公开了纸币，各种产品等，其具有集成电路装置，具有用于控制信息的读取和写入（信息的锁定/解锁）的切换存储器，以便保护记录和存储在信息中的信息 集成电路，例如安装在产品上的IC芯片等。

公开(公告)号：US20110164083A1

公开(公告)日：2011-07-07

申请号：US13049078

申请日：2011-03-16

申请人： Shunpei Yamazaki ,  Jun Koyama ,  Yasuyuki Arai ,  Shihji Maekawa ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Jun Koyama ,  Yasuyuki Arai ,  Shihji Maekawa ,  Yohei Kanno

IPC分类号： B41J2/07

CPC分类号： H01L51/0004 ,  H01L51/56 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1241

摘要： When using a liquid droplet ejection method, a conventional photomask is not required, however, it is required instead that a moving path of a nozzle or a substrate is controlled with accuracy at least in ejecting liquid droplets. According to the characteristics of compositions to be ejected or their pattern, such ejection conditions are desirably set as the moving rate of a nozzle or a substrate, ejection quantity, ejection distance and ejection rate of compositions, atmosphere of the space that the compositions are ejected, the temperature and moisture of the space, and heating temperature of the substrate. A liquid droplet ejection system in accordance with the invention comprises an input means for inputting data of a thin film pattern, a set means for setting a nozzle for a ejecting a composition containing a material for forming the thin film or setting a moving path of the substrate to which the composition is ejected, an image pick-up means for detecting an alignment marker formed on a substrate and a control means for controlling the moving path of the nozzle or the substrate.

摘要翻译： 当使用液滴喷射方法时，不需要常规的光掩模，然而，需要至少在喷射液滴时精确地控制喷嘴或基板的移动路径。 根据要喷射的组合物或其图案的特征，这种喷射条件期望设置为喷嘴或基底的移动速率，喷射量，喷射距离和组合物的喷射速率，组合物喷出的空间的气氛 ，空间的温度和湿度，以及基板的加热温度。 根据本发明的液滴喷射系统包括用于输入薄膜图案的数据的输入装置，用于设置用于喷射包含用于形成薄膜的材料的组合物的喷嘴的设定装置或设置该薄膜图案的移动路径 用于检测形成在基板上的取向标记的图像拾取装置和用于控制喷嘴或基板的移动路径的控制装置。

公开(公告)号：US20110159186A1

公开(公告)日：2011-06-30

申请号：US12975492

申请日：2010-12-22

申请人： Andrew Chakchung Yu ,  Takahiro Kawana ,  Hidetoshi Honda ,  Seiichi Onodera ,  Yohei Kanno

发明人： Andrew Chakchung Yu ,  Takahiro Kawana ,  Hidetoshi Honda ,  Seiichi Onodera ,  Yohei Kanno

IPC分类号： C23C16/458 ,  C23C16/00 ,  C23C16/44

CPC分类号： C23C16/45548 ,  C23C16/45574 ,  C23C16/46 ,  C23C16/52 ,  C23C16/545

摘要： The present invention provides a film forming apparatus and a film forming method realizing improvement in the degree of freedom in film formation while suppressing production cost. While conveying a base material by using a plurality of guide rolls, film formation is performed by atomic layer deposition by outputting precursor gases to the base material by a plurality of ALD heads. The ALD heads are disposed so as to individually face the guide rolls so that the precursor gases are locally output to the base material. The amount of the precursor gases used is reduced more than that in a related art, and the variety of kinds of the usable precursor gases is widened.

摘要翻译： 本发明提供了一种在抑制生产成本的同时实现成膜自由度的提高的成膜装置和成膜方法。 在通过使用多个导辊输送基材的同时，通过原子层沉积通过多个ALD头将母体气体输出到基材进行成膜。 ALD头被设置成分别面向导辊，使得前体气体局部地输出到基底材料。 所使用的前体气体的量比现有技术中减少了多少，并且可用的前体气体的种类多种多样。

公开(公告)号：US07728734B2

公开(公告)日：2010-06-01

申请号：US12336611

申请日：2008-12-17

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G08B13/14

CPC分类号： G06K19/07722 ,  G06K19/07749 ,  G08B13/2417 ,  G08B13/2437

摘要： In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to a decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.

摘要翻译： 在与非接触型或接触型ID标签或ID标签相连的商业产品中，ID卡有恐惧，由于通信用天线与设置在天线周围的树脂之间的热膨胀系数之间的差异 对具有较大的热膨胀系数的树脂施加应力以破坏树脂。 这有助于ID标签等的制造产量，寿命和可靠性的降低。 在根据本发明的诸如ID标签，ID标签和ID卡的物品中，在形成ID标签，ID标签和ID卡的天线周围的填充层中包括填充物，使得 可以降低天线与填充层之间的热膨胀系数的差异。 这使得可以缓解由于热膨胀系数的差异导致的应力的产生，并且防止填充层的剥离和裂纹。

公开(公告)号：US07572718B2

公开(公告)日：2009-08-11

申请号：US11092773

申请日：2005-03-30

申请人： Yohei Kanno ,  Yasuko Watanabe

发明人： Yohei Kanno ,  Yasuko Watanabe

IPC分类号： H01L21/3205

CPC分类号： H01L29/42384 ,  H01L21/268 ,  H01L27/1292 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/78621

摘要： In the case of providing an LDD region for a TFT, it is necessary to form separately an insulating film to be a mask or to contrive the shape of a gate electrode layer in order to have the concentration difference in impurities injected in a semiconductor film; therefore, the number of patterning steps has increased as a matter of course and the step has become complicated. A semiconductor device according to one feature of the invention comprises a semiconductor layer including a channel region, a pair of impurity regions, and a pair of low-concentration impurity regions; and a gate electrode layer having a single layer structure or a laminated structure, of which film thickness is not even, which is formed to be in contact with the semiconductor layer by sandwiching a gate insulating film therebetween. Particularly, the gate electrode layer, of which film thickness is not even, can be formed easily by employing a droplet discharging method; thus, the convenience of the droplet discharging method can be taken with full advantage.

摘要翻译： 在为TFT提供LDD区域的情况下，需要分别形成作为掩模的绝缘膜或者为了使注入半导体膜中的杂质的浓度差成为栅极电极层的形状; 因此，图案化步骤的数量当然增加，并且步骤变得复杂。 根据本发明的一个特征的半导体器件包括：半导体层，包括沟道区，一对杂质区和一对低浓度杂质区; 以及通过在其间夹有栅极绝缘膜而形成为与半导体层接触的膜厚不均匀的单层结构或层叠结构的栅极电极层。 特别地，通过采用液滴喷射法可以容易地形成膜厚不均匀的栅电极层; 因此，可以充分利用液滴喷射方法的方便性。

公开(公告)号：US20080009125A1

公开(公告)日：2008-01-10

申请号：US11896509

申请日：2007-09-04

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

IPC分类号： H01L21/30 ,  H01L21/84

CPC分类号： H01L21/6835 ,  G06K19/0704 ,  G06K19/0723 ,  G06K19/07703 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/45147 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00011

摘要： With non-contact and contact IC chips becoming common, it is necessary to mass-produce enormous amount of IC chips, which are utilizable for human beings, animals and plants, commercial products, banknotes, and the like, at low cost. For example, it is necessary to manufacture IC chips to be applied to commercial products, banknotes, and the like at a cost of 1 to several yen per IC chip, preferably, at a cost less than 1 yen, and it is desired to realize a structure of an IC chip that can be mass-produced at low cost and a manufacturing process of the IC chip. A method of manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer.

摘要翻译： 随着非接触式和接触式IC芯片的普及，需要大量生产大量可用于人类，动植物，商业产品，纸币等的IC芯片，成本低廉。 例如，以IC成本为1〜数日元的成本，优选以不到1日元的成本为代价，制造适用于商品，纸币等的IC芯片是有必要的。 可以低成本大量生产的IC芯片的结构和IC芯片的制造工艺。 根据本发明的制造薄膜集成电路器件的方法包括以下步骤：在热氧化硅衬底上形成剥离层，在剥离层上形成多个薄膜集成电路器件，底片 在所述多个薄膜集成电路器件之间形成沟槽，并且通过将包含卤素氟化物的气体和液体中的一种引入到所述沟槽中以去除所述剥离层来分离所述多个薄膜集成电路器件。

公开(公告)号：US20070159353A1

公开(公告)日：2007-07-12

申请号：US10586049

申请日：2005-01-20

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yohei Kanno ,  Yuko Tachimura

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yohei Kanno ,  Yuko Tachimura

IPC分类号： G08C19/04 ,  G08C19/10

CPC分类号： H01L27/1266 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/13

摘要： Since the chip formed from a silicon wafer is thick, the chip is protruded from the surface or the chip is so large that it can be seen through the eyes, which affects the design of a business card or the like. Hence, it is an object of the present invention to provide a new integrated circuit which has a structure by which the design is not affected. In view of the above problems, it is a feature of the invention to equip a film-like article with a thin film integrated circuit. It is another feature of the invention that the IDF chip has a semiconductor film of 0.2 mm or less, as an active region. Therefore, the IDF chip can be made thinner as compared with a chip formed from a silicon wafer. In addition, such an integrated circuit can have light transmitting characteristic unlike a chip formed from a silicon wafer.

摘要翻译： 由于由硅晶片形成的芯片较厚，所以芯片从表面突出，或者芯片大到可以通过眼睛看到，影响到名片的设计等。 因此，本发明的目的是提供一种新的集成电路，其具有不影响设计的结构。 鉴于上述问题，本发明的一个特征是为薄膜集成电路配备薄膜状制品。 本发明的另一个特征是IDF芯片具有0.2mm以下的半导体膜作为活性区域。 因此，与由硅晶片形成的芯片相比，可以使IDF芯片更薄。 此外，这种集成电路可以具有与由硅晶片形成的芯片不同的透光特性。