Invention Grant
US08241962B2 Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
有权
制造具有柱/基散热器，信号柱和腔的半导体芯片组件的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
- Patent Title (中): 制造具有柱/基散热器，信号柱和腔的半导体芯片组件的方法
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Application No.: US12834014Application Date: 2010-07-12
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Publication No.: US08241962B2Publication Date: 2012-08-14
- Inventor: Charles W. C. Lin , Chia-Chung Wang , Sangwhoo Lim
- Applicant: Charles W. C. Lin , Chia-Chung Wang , Sangwhoo Lim
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/603
- IPC: H01L21/603
Abstract:
A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
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