公开(公告)号：US08232576B1

公开(公告)日：2012-07-31

申请号：US12848175

申请日：2010-08-01

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/29144 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2924/0105 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a ceramic block. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ceramic block is embedded in the post. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the ceramic block. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括柱，基座和陶瓷块。 柱从基部向上延伸到粘合剂中的开口中，基部从柱侧向延伸，并且陶瓷块嵌入柱中。 半导体器件与陶瓷块重叠，电连接到导电迹线并且热连接到陶瓷块。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08415703B2

公开(公告)日：2013-04-09

申请号：US12876106

申请日：2010-09-04

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/00

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括柱，基座和凸缘。 导电迹线包括焊盘和端子。 半导体器件延伸到法兰中的空腔中，电连接到导电迹线并与散热器热连接。 柱从基部向上延伸到粘合剂中的开口中，凸缘从开口中的柱向上延伸并且在粘合剂的上方横向延伸，空腔延伸到开口中，并且基部从柱横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US08193556B2

公开(公告)日：2012-06-05

申请号：US12714413

申请日：2010-02-26

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The semiconductor device extends into a cavity in the post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括一个柱子和一个底座。 半导体器件延伸到柱中的空腔中，电连接到导电迹线并且热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线位于腔体外部，并提供焊盘和端子之间的信号路由。

公开(公告)号：US08212279B2

公开(公告)日：2012-07-03

申请号：US12833947

申请日：2010-07-10

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/62 ,  H01L23/36 ,  H01L23/48 ,  H01L33/64

CPC分类号： H01L33/486 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5389 ,  H01L33/642 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括热柱和基座。 导电迹线包括垫，端子和信号柱。 半导体器件延伸到热柱中的空腔中，电连接到导电迹线并且热连接到散热器。 热柱从基部向上延伸到粘合剂中的第一开口中，并且信号柱从端子向上延伸到粘合剂中的第二开口中。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US09018667B2

公开(公告)日：2015-04-28

申请号：US12758040

申请日：2010-04-12

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/495 ,  H05K1/02 ,  H01L33/48 ,  H01L33/64 ,  H05K3/00 ,  H05K3/38

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部穿过第一粘合剂中的开口向上延伸，并且基部从柱横向延伸。 第一粘合剂在基部和导电迹线之间延伸，并且第二粘合剂在柱和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08076182B2

公开(公告)日：2011-12-13

申请号：US12714495

申请日：2010-02-28

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L21/00

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱上方的粘合剂中形成空腔，然后将半导体器件安装在柱上，其中 散热器包括柱和基座，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US08241962B2

公开(公告)日：2012-08-14

申请号：US12834014

申请日：2010-07-12

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L21/603

CPC分类号： H01L33/486 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5389 ,  H01L33/642 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 制造半导体芯片组件的方法包括提供热柱，信号柱和基座，将粘合剂安装在基座上，包括将热柱插入粘合剂中的第一开口中，并将信号柱插入粘合剂中的第二开口中 将导电层安装在粘合剂上，包括将热柱与导电层中的第一孔对准，并且将信号柱与导电层中的第二孔对准，然后使粘合剂在热柱和导电层之间以及在导电层之间向上流动 信号柱和导电层，固化粘合剂，提供包括焊盘，端子和信号柱的导电迹线，其中焊盘包括导电层的选定部分，将半导体器件安装在热柱上，其中 散热器包括热柱和基座，并且半导体器件延伸到热柱中的空腔中，电连接 半导体器件到导电迹线并将半导体器件热连接到散热器上。

公开(公告)号：US08207553B2

公开(公告)日：2012-06-26

申请号：US12714421

申请日：2010-02-26

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括一个底座。 空腔通过粘合剂延伸到基座中。 半导体器件延伸到腔中，电连接到导电迹线并且热连接到散热器。 粘合剂在空腔和导电迹线之间以及基底和导电迹线之间延伸。 导电迹线位于腔体外部，并提供焊盘和端子之间的信号路由。

公开(公告)号：US08003416B2

公开(公告)日：2011-08-23

申请号：US12759699

申请日：2010-04-14

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L21/00

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 制造半导体芯片组件的方法包括提供柱和基座，将第一粘合剂安装在基座上，包括将柱穿过第一粘合剂中的开口，将导电层安装在基座上，包括使柱与孔对准 导电层，提供导电迹线，其包括焊盘，端子和导电层的选定部分，然后使第二粘合剂在柱和导电迹线之间的间隙中和向下流动，固化第二粘合剂，然后安装 包括柱和基座的散热器上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US07939375B2

公开(公告)日：2011-05-10

申请号：US12714494

申请日：2010-02-28

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱中形成空腔，然后将半导体器件安装在柱上，其中散热器 包括柱和基部，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。