Invention Grant
US08241978B2 Method of manufacturing semiconductor device having integrated MOSFET and Schottky diode
有权
具有集成MOSFET和肖特基二极管的半导体器件的制造方法
- Patent Title: Method of manufacturing semiconductor device having integrated MOSFET and Schottky diode
- Patent Title (中): 具有集成MOSFET和肖特基二极管的半导体器件的制造方法
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Application No.: US12536504Application Date: 2009-08-06
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Publication No.: US08241978B2Publication Date: 2012-08-14
- Inventor: Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
- Applicant: Wei-Chieh Lin , Li-Cheng Lin , Hsin-Yu Hsu , Ho-Tai Chen , Jen-Hao Yeh , Guo-Liang Yang , Chia-Hui Chen , Shih-Chieh Hung
- Applicant Address: TW Hsinchu Science Park, Hsin-Chu
- Assignee: Anpec Electronics Corporation
- Current Assignee: Anpec Electronics Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW98115824A 20090513
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/336

Abstract:
A semiconductor device having integrated MOSFET and Schottky diode includes a substrate having a MOSFET region and a Schottky diode region defined thereon; a plurality of first trenches formed in the MOSFET region; and a plurality of second trenches formed in the Schottky diode region. The first trenches respectively including a first insulating layer formed over the sidewalls and bottom of the first trench and a first conductive layer filling the first trench serve as a trenched gate of the trench MOSFET. The second trenches respectively include a second insulating layer formed over the sidewalls and bottom of the second trench and a second conductive layer filling the second trench. A depth and a width of the second trenches are larger than that of the first trenches; and a thickness of the second insulating layer is larger than that of the first insulating layer.
Public/Granted literature
- US20100289075A1 SEMICONDUCTOR DEVICE HAVING INTEGRATED MOSFET AND SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-11-18
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