Invention Grant
US08242537B2 IGBT with fast reverse recovery time rectifier and manufacturing method thereof
有权
具有快速反向恢复时间整流器的IGBT及其制造方法
- Patent Title: IGBT with fast reverse recovery time rectifier and manufacturing method thereof
- Patent Title (中): 具有快速反向恢复时间整流器的IGBT及其制造方法
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Application No.: US12615278Application Date: 2009-11-10
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Publication No.: US08242537B2Publication Date: 2012-08-14
- Inventor: Wei-Chieh Lin , Jen-Hao Yeh , Ho-Tai Chen
- Applicant: Wei-Chieh Lin , Jen-Hao Yeh , Ho-Tai Chen
- Applicant Address: TW Hsinchu Science Park, Hsin-Chu
- Assignee: Anpec Electronics Corporation
- Current Assignee: Anpec Electronics Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW98133846A 20091006
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L21/331

Abstract:
An IGBT with a fast reverse recovery time rectifier includes an N-type drift epitaxial layer, a gate, a gate insulating layer, a P-type doped base region, an N-type doped source region, a P-type doped contact region, and a P-type lightly doped region. The P-type doped base region is disposed in the N-type drift epitaxial layer, and the P-type doped contact region is disposed in the N-type drift epitaxial layer. The P-type lightly doped region is disposed between the P-type contact doped region and the N-type drift epitaxial layer, and is in contact with the N-type drift epitaxial layer.
Public/Granted literature
- US20110079819A1 IGBT WITH FAST REVERSE RECOVERY TIME RECTIFIER AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-04-07
Information query
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