Invention Grant
US08247159B2 Positive resist composition and method of forming resist pattern
有权
正型抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Positive resist composition and method of forming resist pattern
- Patent Title (中): 正型抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US12299529Application Date: 2007-04-18
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Publication No.: US08247159B2Publication Date: 2012-08-21
- Inventor: Masaru Takeshita , Ryoji Watanabe
- Applicant: Masaru Takeshita , Ryoji Watanabe
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2006-145284 20060525
- International Application: PCT/JP2007/058444 WO 20070418
- International Announcement: WO2007/138797 WO 20071206
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30

Abstract:
A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a0) represented by general formula (a0) shown below and a structural unit (a1) derived from an acrylate ester having a polycyclic group-containing, acid dissociable, dissolution inhibiting group of a tertiary alkyl ester-type: wherein: R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; Y1 represents an aliphatic cyclic group; Z represents a tertiary alkyl group-containing group; a represents an integer of 1 to 3, and b represents an integer of 0 to 2, such that a+b=1 to 3; and each of c, d and e independently represents an integer of 0 to 3.
Public/Granted literature
- US20090068592A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2009-03-12
Information query
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